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JESDAE_电子/电路_工程科技_专业资料。JEDEC STANDARD High Temperature Storage Life JESDAE (Revision of. JEDEC STANDARD High Temperature Storage Life JESDAC (Revision of JESDAB) NOVEMBER JEDEC SOLID STATE. JESD A J-STD Preconditioning (PC): PC required for SMDs only. JESD A High Temperature Storage Life (HTSL). °C for hrs.

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This test may be destructive, depending on time, temperature and packaging if any. I recommend changes to the following: For nonvolatile memories, the data specified data retention pattern must be written initially, and then subsequently verified without re-writing. Cosmetic package defects and degradation of lead jes2d2, or solderability are not considered valid failure criteria for this stress.

NC-A high-rate and lon For example Glass Transition Temperature and thermal stability in x103 of any polymeric materials.

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A margin test may be used to detect data retention degradation. Jexd22 comments will be collected and dispersed to the appropriate committee s. All comments will be collected and dispersed to the appropriate committee s.

Requirement, clause number Test method number Clause number Fax: Thermally activated failure mechanisms are modeled using the Arrhenius Equation for acceleration.

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Solid State Memories JC For nonvolatile memories, the ejsd22 specified data retention pattern must be written initially, and then subsequently verified without re-writing.

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Degradation of metals including metallurgical interfaces.

Most of the content on this site remains free to download with registration. This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. During the test, accelerated stress temperatures are used without electrical conditions applied.

The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Modified text to emphasize that stress ejsd22 requirements are stated in qualification documents, such as JESD47 or in customer agreements, and not in this test method.

Suite Arlington, VA 1. Other suggestions for document improvement: Learn more and apply today.

Search by Keyword or Document Number. Table 1 — High Temperature storage conditions Condition A: Interim measurements are optional unless otherwise specified. Alternatively, application of a knowledge-based test method that reconciles use condition data JESD94 and an understanding of reliability models and failure mechanisms JEP can provide the test durations for any selected stress condition in Uesd22 1.

kesd22 Quality and Reliability of Solid State Products filter. As a minimum the following items should be taken into consideration: The devices may be returned to room ambient conditions for interim electrical measurements. Table 1 — High temperature storage conditions Condition A: Charge loss in Nonvolatile memories.

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Degradation of metals includes metallurgical interfaces. For nonvolatile memories, the specified data retention pattern shall be verified before and after storage. I recommend changes to the following: Intermediate measurements are optional unless otherwise specified.

The high temperature storage test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure mechanisms and time-tofailure distributions of solid state electronic devices, including nonvolatile memory devices data retention failure mechanisms. This test may be destructive, depending on Time, Temperature and Packaging if any. Some punctuation changes are not included.

A margin test may be used to detect data retention degradation. JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. For nonvolatile memories, the specified data retention pattern shall be verified before and after storage.

Other suggestions for document improvement: During the test elevated temperatures accelerated test conditions are used without electrical stress applied.

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The electrical test measurements shall consist of parametric and functional tests specified in the applicable procurement document. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement.

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